Invention Grant
- Patent Title: Multiple semiconductor device trenches per cell pitch
- Patent Title (中): 每个单元间距多个半导体器件沟槽
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Application No.: US14447864Application Date: 2014-07-31
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Publication No.: US09252263B1Publication Date: 2016-02-02
- Inventor: Martin Vielemeyer , Michael Hutzler
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40

Abstract:
A semiconductor device includes a plurality of field plate trenches formed in a semiconductor substrate, a plurality of gate trenches formed in the semiconductor substrate and spaced apart from the field plate trenches, and a plurality of device cells having a cell pitch defined by a distance from one side of a field plate trench to the same side of an adjacent field plate trench. Each device cell includes a first doped region of a first conductivity type and a second doped region of a second conductivity type adjacent the first doped region in a part of the semiconductor substrate disposed between the adjacent field plate trenches that define the cell pitch. At least some of the device cells have more than one gate trench per cell pitch.
Public/Granted literature
- US20160035882A1 MULTIPLE SEMICONDUCTOR DEVICE TRENCHES PER CELL PITCH Public/Granted day:2016-02-04
Information query
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