Invention Grant
- Patent Title: Method for manufacturing nitride semiconductor element
- Patent Title (中): 氮化物半导体元件的制造方法
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Application No.: US14670106Application Date: 2015-03-26
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Publication No.: US09252323B2Publication Date: 2016-02-02
- Inventor: Atsuo Michiue
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2014-068383 20140328
- Main IPC: H01G9/20
- IPC: H01G9/20 ; H01L33/00 ; H01L33/18

Abstract:
A first nitride semiconductor layer laminating step includes a first step and a second step. In the first step, an entire upper surface of the sapphire substrate is coated with a first nitride semiconductor layer, while supplying oxygen. In the second step, crystals of the first nitride semiconductor layer are grown by supplying oxygen at a smaller flow rate than that of oxygen supplied in the first step, or without supplying the oxygen.
Public/Granted literature
- US20150280055A1 METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR ELEMENT Public/Granted day:2015-10-01
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