Invention Grant
- Patent Title: LED package
- Patent Title (中): LED封装
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Application No.: US14521103Application Date: 2014-10-22
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Publication No.: US09252343B2Publication Date: 2016-02-02
- Inventor: Kwon-Jin Kim , Hee-Dong Kim , Hee-Seok Park , Ji-Seok Wang , Yong-Kee Jo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0030478 20140314
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L27/15 ; H01L33/50
Abstract:
An LED package includes a package substrate, a first LED chip mounted on the package substrate, a first phosphor layer disposed on the first LED chip, a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer.
Public/Granted literature
- US20150263253A1 LED PACKAGE Public/Granted day:2015-09-17
Information query
IPC分类:
