Invention Grant
- Patent Title: Electronic devices with yielding substrates
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Application No.: US14704334Application Date: 2015-05-05
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Publication No.: US09252373B2Publication Date: 2016-02-02
- Inventor: Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant: Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant Address: CA Richmond
- Assignee: Cooledge Lighting, Inc.
- Current Assignee: Cooledge Lighting, Inc.
- Current Assignee Address: CA Richmond
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00 ; H01L51/00 ; H01L23/498 ; H01L23/538
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US20150236214A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES Public/Granted day:2015-08-20
Information query
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