Invention Grant
- Patent Title: Hybrid single aperture inclined antenna
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Application No.: US14023906Application Date: 2013-09-11
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Publication No.: US09252497B2Publication Date: 2016-02-02
- Inventor: Ferdinando Tiezzi , Stefano Vaccaro , Daniel Llorens del Rio
- Applicant: ViaSat, Inc.
- Applicant Address: US CA Carlsbad
- Assignee: ViaSat, Inc.
- Current Assignee: ViaSat, Inc.
- Current Assignee Address: US CA Carlsbad
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01P1/04

Abstract:
In an exemplary embodiment, an antenna architecture comprises a single aperture having both receive elements and transmit elements, where the single aperture has the performance of a dual-aperture but in about half the size. Moreover, in the case of an array with inclined elements, there is the need to interconnect a planar substrate with an inclined substrate at an angle. An exemplary single aperture comprises a metal core having a thick pass-through slot from a first side to a second side; connecting the inclined substrate to the first side of the metal core, and connecting a second substrate to the second side of the metal core. Furthermore, an RF signal is communicated between the first substrate and the second substrate in a contactless manner through the thick pass-through slot.
Public/Granted literature
- US20140009357A1 Hybrid Single Aperture Inclined Antenna Public/Granted day:2014-01-09
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