An electrical grounding device can have a grounding plate and an insulated connecting wire. Having an insulated connecting wire reduces or prevents corrosion of the connecting wire by the surrounding underground soil. A grounding assembly is also provided and can have such a grounding device. The grounding assembly can include additional grounding devices which can also have an insulated connecting wire. A method of measuring resistance to ground of a grounding device of a grounding assembly having a multiple grounding devices and one or more bonding wires routed through a conduit is also disclosed. Having all but one of the connecting wires and bonding wires insulated or insulating all the connecting wires of the grounding devices of the grounding assembly allows measurement of resistance to ground by electrically disconnecting all but the connecting wire of the grounding device to be tested, contacting one terminal of an ohm meter to the connecting wire of the grounding device to be tested and contacting the other terminal of the ohm meter to the earth or ground, and reading the ohm meter.