Invention Grant
- Patent Title: Socket and electronic component mounting structure
- Patent Title (中): 插座和电子元件安装结构
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Application No.: US14088902Application Date: 2013-11-25
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Publication No.: US09252513B2Publication Date: 2016-02-02
- Inventor: Yasushi Masuda , Akira Tamura , Yoshihiro Morita , Satoshi Ohsawa
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2012-264276 20121203
- Main IPC: H01R31/06
- IPC: H01R31/06 ; H05K1/11 ; H01R12/71 ; H05K7/10

Abstract:
A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.
Public/Granted literature
- US20140154925A1 SOCKET AND ELECTRONIC COMPONENT MOUNTING STRUCTURE Public/Granted day:2014-06-05
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