Invention Grant
- Patent Title: Electric connection structure of electronic component
- Patent Title (中): 电子元件电气连接结构
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Application No.: US14572906Application Date: 2014-12-17
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Publication No.: US09252518B2Publication Date: 2016-02-02
- Inventor: Takahiro Miwa , Masahiro Kimura
- Applicant: Aisin Seiki Kabushiki Kaisha
- Applicant Address: JP Kariya-shi
- Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee Address: JP Kariya-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2013-264107 20131220
- Main IPC: H01R4/24
- IPC: H01R4/24 ; H01R13/08 ; H01R12/71 ; H01R13/66 ; H01R12/52 ; H01R12/70 ; H01R13/506

Abstract:
An electric connection structure of an electronic component includes: an electric conductor that has a connection pin formed of an electric conductive metal and in which a contact is formed in an end portion opposite to the connection pin; an electronic component that has a metal terminal for inputting and outputting an electric signal, on a bottom surface which opposes the electric conductor; and a housing that has a holding portion for holding the electric conductor and a fixing portion for fixing the electronic component, wherein the electronic component is brought into contact with the housing, and is fixed by the fixing portion so that the contact is elastically deformed and the metal terminal and the contact are electrically connected to each other.
Public/Granted literature
- US20150180152A1 ELECTRIC CONNECTION STRUCTURE OF ELECTRONIC COMPONENT Public/Granted day:2015-06-25
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