Invention Grant
- Patent Title: Data cabling jack device and data cabling assembly structure
- Patent Title (中): 数据布线插孔设备和数据布线组装结构
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Application No.: US14135575Application Date: 2013-12-19
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Publication No.: US09252533B2Publication Date: 2016-02-02
- Inventor: Chu-Li Wang
- Applicant: EMCOM TECHNOLOGY INC.
- Applicant Address: TW Taipei
- Assignee: EMCOM TECHNOLOGY INC.
- Current Assignee: EMCOM TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Agent Cheng-Ju Chiang
- Priority: CN201220708368 20121220
- Main IPC: H01R13/627
- IPC: H01R13/627 ; H01R13/629 ; H01R13/639 ; H01R13/518

Abstract:
A data cabling jack device for configuring a plurality of cables on an assembly frame is provided. The data cabling jack device includes a housing and an engaging structure. The housing has an accommodation space, wherein the housing includes a jack side and a cable side opposite to the jack side. The engaging structure is disposed on the housing and has an engaging switch and an engaging portion, wherein the engaging switch is switched between a release position and an engaging position. The release position and the engaging position are respectively disposed nearby the cable side and the jack side. The engaging portion engages the assembly frame when the engaging switch is switched from the release position to the engaging position to drive the engaging portion to protrude out of the assembly frame.
Public/Granted literature
- US20140179137A1 DATA CABLING JACK DEVICE AND DATA CABLING ASSEMBLY STRUCTURE Public/Granted day:2014-06-26
Information query