A dual orientation connector assembly for mating with a mating connector in two directions, including: an insulative housing defining a side wall, a printed circuit board (PCB) received in the housing, a mating member soldered on the PCB, a cable extending from an end of the insulative housing, and a magnetic component disposed in the insulative housing to provide a retaining force for retaining to the mating connector. The mating member includes a mounting portion received in the insulative housing, a mating portion extending out of the side wall of the insulative housing for mating with the mating connector, and a number of terminals mounted in the mating portion. The mating portion includes a first surface and an opposite second surface. The first surface and the second surface have the same number of the terminals.