Invention Grant
- Patent Title: Method of manufacturing light emitting element
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Application No.: US14449804Application Date: 2014-08-01
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Publication No.: US09252566B2Publication Date: 2016-02-02
- Inventor: Noriyuki Futagawa , Tatsushi Hamaguchi , Masaru Kuramoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-166572 20130809
- Main IPC: H01S5/183
- IPC: H01S5/183 ; H01S5/30 ; B82Y20/00 ; H01S5/02 ; H01S5/042 ; H01S5/343

Abstract:
A method of manufacturing a light emitting element includes, sequentially, (a) forming a mask layer for selective growth; (b) forming a layered structure body by layering a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; (c) forming, on the second surface of the second compound semiconductor layer, a second electrode and a second light reflecting layer formed from a multilayer film; (d) fixing the second light reflecting layer to a support substrate; (e) removing the substrate for manufacturing a light emitting element, and exposing the first surface of the first compound semiconductor layer and the mask layer; and (f) forming a first light reflecting layer formed from a multilayer film and a first electrode on the first surface of the first compound semiconductor layer.
Public/Granted literature
- US20150044795A1 METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT Public/Granted day:2015-02-12
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