Invention Grant
- Patent Title: Multi-protocol I/O interconnect architecture
- Patent Title (中): 多协议I / O互连体系结构
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Application No.: US13338222Application Date: 2011-12-27
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Publication No.: US09252970B2Publication Date: 2016-02-02
- Inventor: Prashant Chandra , Kevin C. Kahn
- Applicant: Prashant Chandra , Kevin C. Kahn
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04L12/46

Abstract:
Described are embodiments of methods, apparatuses, and systems for multi-protocol tunneling across a multi-protocol I/O interconnect of computer apparatus. A method for configuring a multi-protocol I/O interconnect may include identifying a plurality of switches of a switching fabric of a multi-protocol I/O interconnect, and configuring a path from a port of a first switch of the plurality of switches to a port of a second switch of the plurality of switches. Packets of a first protocol and packets of a second protocol, different from the first protocol, may be simultaneously routed over the path. Other embodiments may be described and claimed.
Public/Granted literature
- US20130163474A1 MULTI-PROTOCOL I/O INTERCONNECT ARCHITECTURE Public/Granted day:2013-06-27
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