Invention Grant
- Patent Title: Bone conduction speaker unit
- Patent Title (中): 骨传导扬声器单元
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Application No.: US14364135Application Date: 2013-10-25
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Publication No.: US09253563B2Publication Date: 2016-02-02
- Inventor: Mikio Fukuda
- Applicant: TEMCO JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TEMCO JAPAN CO., LTD.
- Current Assignee: TEMCO JAPAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: JP2012-258684 20121127; JP2013-172564 20130822
- International Application: PCT/JP2013/078995 WO 20131025
- International Announcement: WO2014/083986 WO 20140605
- Main IPC: H04R1/46
- IPC: H04R1/46 ; H04R9/06 ; H04R1/02

Abstract:
Problem: To provide a bone conduction speaker unit which can sufficiently prevent generation of sound leakage at the time of non-calling, and can be easily incorporated in a main body casing of mobile phones, and the like.Solution: A bone conduction speaker unit, being configured by incorporating a bone conduction speaker main body 2 in a housing 1, wherein an elastic plate 21 is fixed on a top face of a plate yoke 17 of the bone conduction speaker main body 2; an elastic base 22 is disposed on a rear face of a yoke 11; and an elastic cover 3 for holding a contact 5 which, upon a pressing force having been applied thereto in use, is abutted against the plate yoke 17 through the elastic plate 21 is loaded on the housing 1 with a gap “a” being held between a bottom face of the contact 5 and a top face of the elastic plate 21.
Public/Granted literature
- US20150264473A1 BONE CONDUCTION SPEAKER UNIT Public/Granted day:2015-09-17
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