Invention Grant
- Patent Title: Inductor assembly and circuit assembly
- Patent Title (中): 电感器组件和电路组件
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Application No.: US13790070Application Date: 2013-03-08
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Publication No.: US09253872B2Publication Date: 2016-02-02
- Inventor: Hyon K. Lee , Daniel P. Brennan , Richard Paul Cormier
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; H01F5/04 ; H01F17/04 ; H01F27/28
Abstract:
An inductor assembly includes an inductor body including an inductor core and a mounting bracket that includes a first leg, a second leg, and a third leg. A portion of the mounting bracket passes through the inductor body, at least one of the first leg and the second leg of the mounting bracket is arranged to be mounted on a substrate, and the third leg of the mounting bracket is arranged to be mounted on an electrical component mounted on the substrate.
Public/Granted literature
- US20140092575A1 ZERO-LENGTH OR NEAR-ZERO-LENGTH LEAD FOR ELECTRICAL COMPONENT Public/Granted day:2014-04-03
Information query
