Invention Grant
US09253880B2 Printed circuit board including a plurality of circuit layers and method for manufacturing the same 有权
包括多个电路层的印刷电路板及其制造方法

Printed circuit board including a plurality of circuit layers and method for manufacturing the same
Abstract:
Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.
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