Invention Grant
- Patent Title: Printed circuit board including a plurality of circuit layers and method for manufacturing the same
- Patent Title (中): 包括多个电路层的印刷电路板及其制造方法
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Application No.: US13689031Application Date: 2012-11-29
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Publication No.: US09253880B2Publication Date: 2016-02-02
- Inventor: Mi Jin Park , Romero Christian , Seung Wook Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2011-0126981 20111130
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H05K3/40 ; H05K3/46

Abstract:
Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.
Public/Granted literature
- US20130133928A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-05-30
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