In a method for integrating at least one electronic component into a printed circuit board or a printed circuit board intermediate product, the following steps are provided: providing a layer for at least temporarily supporting the electronic component, fixing the electronic component on the layer, arranging a conductive layer on the supporting layer with at least one cutout corresponding to the dimensions of the electronic component to be fixed, at least partly encapsulating or covering the component fixed on the supporting layer with an insulating material, exposing the electronic component, and at least partial regions of the conductive layer, which adjoins the component and is arranged on the supporting layer, and at least partly making contact between the electronic component and the conductive layer adjoining the component. Furthermore, a printed circuit board and a printed circuit board intermediate product having an integrated electronic component are provided.