Invention Grant
- Patent Title: Electronic device and electronic device manufacturing method
- Patent Title (中): 电子器件及电子器件制造方法
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Application No.: US13974598Application Date: 2013-08-23
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Publication No.: US09253899B2Publication Date: 2016-02-02
- Inventor: Manabu Hongo , Yoshifumi Kajiwara , Hiroyuki Takita , Hiroshi Kubo , Satoshi Watanabe , Shingo Yamaguchi , Satoshi Kanbayashi , Yasuhiro Ite
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2012-235652 20121025
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16 ; H05K5/02

Abstract:
An electronic device including: a protrusion portion that projects towards a bottom face of a groove from the opposite side face of a second hook portion, that is inserted into the groove, and that makes close contact with a sealing material; and a cut-away portion that is formed to a side wall portion positioned further to the casing inside out of a pair of side wall portions forming the groove, the cut-away portion being formed at a position corresponding to a first hook portion.
Public/Granted literature
- US20140118906A1 ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD Public/Granted day:2014-05-01
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