Invention Grant
- Patent Title: Electronic component cooling system and method
- Patent Title (中): 电子元件冷却系统及方法
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Application No.: US14106414Application Date: 2013-12-13
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Publication No.: US09253919B2Publication Date: 2016-02-02
- Inventor: Michael K. T. Lee
- Applicant: Brocade Communications Systems, Inc.
- Applicant Address: US CA San Jose
- Assignee: BROCADE COMMUNICATIONS SYSTEMS, INC.
- Current Assignee: BROCADE COMMUNICATIONS SYSTEMS, INC.
- Current Assignee Address: US CA San Jose
- Agency: Innovation Counsel LLP
- Agent Serge J. Hodgson
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04D29/60 ; F04D25/16
Abstract:
An electronic device includes a fan field replaceable unit (FRU). The fan FRU includes a fan FRU chassis defining an airflow pathway through the fan FRU. A fan within the fan FRU chassis causes air to flow along the airflow pathway. The fan FRU further includes an edge connector located at a front face of the fan FRU out of the way of the airflow pathway. Accordingly, the edge connector does not block airflow through the fan FRU thus maximizing the efficiency of the fan FRU and the cooling of the electronic device.
Public/Granted literature
- US20150124405A1 ELECTRONIC COMPONENT COOLING SYSTEM AND METHOD Public/Granted day:2015-05-07
Information query
