Invention Grant
- Patent Title: Servo amplifier having cooling structure including heat sink
- Patent Title (中): 具有散热结构的伺服放大器
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Application No.: US14187646Application Date: 2014-02-24
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Publication No.: US09253926B2Publication Date: 2016-02-02
- Inventor: Kenichi Okuaki
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: Fanuc Corporation
- Current Assignee: Fanuc Corporation
- Current Assignee Address: JP Yamanashi
- Agency: Fredrikson & Byron P.A.
- Priority: JP2013-035565 20130226
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/40 ; H01L23/367 ; H01L23/427
Abstract:
A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.
Public/Granted literature
- US20140240925A1 SERVO AMPLIFIER HAVING COOLING STRUCTURE INCLUDING HEAT SINK Public/Granted day:2014-08-28
Information query
