Invention Grant
- Patent Title: Cooling host module
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Application No.: US14045255Application Date: 2013-10-03
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Publication No.: US09253929B2Publication Date: 2016-02-02
- Inventor: Emmanuel Tong-Viet
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Douglas A. Lashmit
- Priority: GB1216173.3 20120911
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20 ; F28F7/00 ; F28D15/00 ; F28F13/00 ; F24F7/00

Abstract:
A cooling host module is operable for providing cooling gas flow in a substantially isolated closed loop for a computing device. The computing device comprises a substantially vertical first face having an inlet portion comprising no more than about a lower third of a height of the first face for inlet gas flow and a substantially vertical second face opposite the first face for outlet gas flow. The cooling host module comprises: a heat exchanger adjacent to the second face of the computing device for cooling outlet gas flow; a gas flow path directing air exiting the heat exchanger beneath the computing unit; a gas moving device for moving gas in the gas flow path; and a vent towards distal end of the gas flow path for providing gas flow to the inlet portion of the first face of the computing device.
Public/Granted literature
- US20140071617A1 COOLING HOST MODULE Public/Granted day:2014-03-13
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