Invention Grant
- Patent Title: Circuit device and inkjet head assembly
- Patent Title (中): 电路设备和喷墨头组件
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Application No.: US13921995Application Date: 2013-06-19
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Publication No.: US09253934B2Publication Date: 2016-02-02
- Inventor: Daisuke Onodera , Akira Wakabayashi
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2012-139120 20120620
- Main IPC: H05K10/00
- IPC: H05K10/00 ; B41J2/01 ; B41J2/14 ; B41J2/045

Abstract:
A circuit device according to an aspect of the present invention includes a circuit board which has one or more wiring layers formed on a base material and has an insulating layer laminated on a surface of the base material opposite to the one or more wiring layers, and a guiding member which is configured to encircle at least a part of an end face of the circuit board so that a space is formed with the end face and to guide movement of a dried body which is supplied to the formed space.
Public/Granted literature
- US20130342608A1 CIRCUIT DEVICE AND INKJET HEAD ASSEMBLY Public/Granted day:2013-12-26
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