• Patent Title: Device for implanting electrically isolated occlusion helixes
  • Application No.: US13916770
    Application Date: 2013-06-13
  • Publication No.: US09254134B2
    Publication Date: 2016-02-09
  • Inventor: Hermann Monstadt
  • Applicant: COVIDIEN LP
  • Applicant Address: DE Bochum
  • Assignee: Dendron GmbH
  • Current Assignee: Dendron GmbH
  • Current Assignee Address: DE Bochum
  • Agent Elizabeth A. O'Brien, Esq.
  • Priority: DE102004003265 20040121
  • Main IPC: A61B17/12
  • IPC: A61B17/12 A61B17/00
Device for implanting electrically isolated occlusion helixes
Abstract:
The invention relates to a device for the implantation of occlusion helixes (3) that can be separated by electrolysis in blood vessels and body cavities, especially aneurysms (12), said device comprising an insertion aid (4), at least one occlusion helix (3) that is distally arranged in relation to the insertion aid (4) and at least one electrolytically corrodible severance element (2), with at least one stabilization helix (5) being arranged between severance element (2) and occlusion helix (3) and said stabilization helix (5) being connected with the occlusion helix (3) by an electrically isolating adhesion layer (7) such that the occlusion helix (3) becomes isolated from the voltage when an electrical voltage is applied to the severance element (2). In this way, the current density in severance element (2) is further increased so that, on the one hand, shorter severance times are achieved and, on the other, the connection between the occlusion helix (3) and one of the stabilization helixes (5) used to stabilize the implant is significantly simplified compared to the known laser welding method according to prior art.
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