Invention Grant
- Patent Title: Porous implant materials and related methods
- Patent Title (中): 多孔植入材料及相关方法
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Application No.: US13756636Application Date: 2013-02-01
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Publication No.: US09254193B2Publication Date: 2016-02-09
- Inventor: Sean H Kerr , David Armbruster , Ami Saheba , James Dwyer , Ali Cern Recber
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Baker & Hostetler LLP
- Main IPC: A61F2/02
- IPC: A61F2/02 ; A61F2/28 ; A61L27/16 ; A61L27/56 ; A61B17/80

Abstract:
Provided are porous, biocompatible implant bodies and materials. These materials suitably comprise a population of randomly arranged thermoplastic constituents, with at least some of the constituents being bonded to one another The implant bodies are capable of being manipulated at room temperature from a first shape to a second shape, and of maintaining the second shape at about internal body temperature. Also provided are related methods of fabricating such implants and installing the implants into a subject.
Public/Granted literature
- US20130211541A1 Porous Implant Materials and Related Methods Public/Granted day:2013-08-15
Information query
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