Invention Grant
- Patent Title: PCB mounting method
- Patent Title (中): PCB安装方式
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Application No.: US12356931Application Date: 2009-01-21
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Publication No.: US09254531B2Publication Date: 2016-02-09
- Inventor: Duk-Yong Kim , Yoon-Yong Kim , Hee-Sung Go
- Applicant: Duk-Yong Kim , Yoon-Yong Kim , Hee-Sung Go
- Applicant Address: KR Hwasong-Kyonggi-Do
- Assignee: KMW Inc.
- Current Assignee: KMW Inc.
- Current Assignee Address: KR Hwasong-Kyonggi-Do
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Kongsik Kim
- Priority: KR10-2008-0005686 20080118
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H05K3/00 ; H05K3/34
Abstract:
Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.
Public/Granted literature
- US20090184155A1 PCB Mounting Method Public/Granted day:2009-07-23
Information query
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