Invention Grant
- Patent Title: Chemical mechanical polishing machine and polishing head assembly
- Patent Title (中): 化学机械抛光机和抛光头组件
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Application No.: US14045157Application Date: 2013-10-03
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Publication No.: US09254546B2Publication Date: 2016-02-09
- Inventor: In-Kwon Kim , Kyung-Hyun Kim , Ki-Jong Park , Ki-Ho Bae , Jong-Heun Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0017488 20130219
- Main IPC: B24B37/30
- IPC: B24B37/30 ; B24B37/32 ; B24B37/10 ; B24B37/04
Abstract:
A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.
Public/Granted literature
- US20140235144A1 CHEMICAL MECHANICAL POLISHING MACHINE AND POLISHING HEAD ASSEMBLY Public/Granted day:2014-08-21
Information query
