Invention Grant
- Patent Title: Side pad design for edge pedestal
- Patent Title (中): 边垫设计用于边缘基座
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Application No.: US12751743Application Date: 2010-03-31
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Publication No.: US09254547B2Publication Date: 2016-02-09
- Inventor: Yin Yuan , Hung Chih Chen , Shou-Sung Chang
- Applicant: Yin Yuan , Hung Chih Chen , Shou-Sung Chang
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24B37/005 ; B24B37/10 ; B24B37/34
Abstract:
A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.
Public/Granted literature
- US20110244763A1 SIDE PAD DESIGN FOR EDGE PEDESTAL Public/Granted day:2011-10-06
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