Invention Grant
- Patent Title: Injection molding machine
- Patent Title (中): 注塑机
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Application No.: US14678009Application Date: 2015-04-03
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Publication No.: US09254593B2Publication Date: 2016-02-09
- Inventor: Keisuke Sugahara
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JP2014-077984 20140404
- Main IPC: B29C45/64
- IPC: B29C45/64 ; B29C45/03 ; B29C45/17 ; B29C45/78 ; B29C45/77
Abstract:
An injection molding machine is provided with an injection device, a mold clamping device, an electric storage device configured to supply electric power to the injection device and/or the mold clamping device, and a machine base. The machine base is provided with an upper frame, a lower frame, and support means supporting the upper frame on the lower frame, the injection device and the mold clamping device are disposed on the upper frame of the machine base, and the electric storage device is disposed on the lower frame. The electric storage device is formed of a case body and an electric storage unit therein.
Public/Granted literature
- US20150283738A1 INJECTION MOLDING MACHINE Public/Granted day:2015-10-08
Information query
