Invention Grant
- Patent Title: Adjustment mechanism for movable platen
- Patent Title (中): 可移动压板调整机构
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Application No.: US14505664Application Date: 2014-10-03
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Publication No.: US09254597B2Publication Date: 2016-02-09
- Inventor: Shingo Okada
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JP2013-209066 20131004
- Main IPC: B29C45/17
- IPC: B29C45/17 ; B29C45/66

Abstract:
An adjustment mechanism for a movable platen of an injection molding machine is provided with a push bolt, configured to apply a force to push up the movable platen against a gravitational force, and a pull bolt, configured to apply a force to draw in the movable platen in the direction of gravity. The movable platen is adjusted by regulating its height above a base of the molding machine in a plurality of positions at different distances from a fixed platen.
Public/Granted literature
- US20150099031A1 ADJUSTMENT MECHANISM FOR MOVABLE PLATEN Public/Granted day:2015-04-09
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