Invention Grant
- Patent Title: Manufacturing method for transparent substrate
- Patent Title (中): 透明基板的制造方法
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Application No.: US13640444Application Date: 2011-04-28
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Publication No.: US09254627B2Publication Date: 2016-02-09
- Inventor: Daisuke Hattori , Takeshi Murashige , Tadayuki Kameyama
- Applicant: Daisuke Hattori , Takeshi Murashige , Tadayuki Kameyama
- Applicant Address: JP Ibaraki-shi
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-105140 20100430; JP2010-252704 20101111
- International Application: PCT/JP2011/060367 WO 20110428
- International Announcement: WO2011/136327 WO 20111103
- Main IPC: B44C1/17
- IPC: B44C1/17 ; B32B17/06 ; B32B7/06 ; B32B17/10 ; B29C65/00 ; B32B38/00 ; G02F1/1333 ; B32B7/12 ; B29L9/00 ; B29L7/00 ; B29C65/48 ; B29L31/34 ; B32B37/00 ; B32B37/12 ; B32B38/10 ; B32B38/16

Abstract:
There is provided a manufacturing method for a transparent substrate excellent in bending property, flexibility, impact resistance, and external appearance. A manufacturing method for a transparent substrate according to an embodiment of the present invention includes: a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to form an applied layer; a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition to form a laminate; a step C of subjecting the laminate to a first heat treatment to reduce an amount of a solvent remaining in the applied layer to a predetermined amount; and a step D including peeling the support backing from the laminate and subjecting the resultant to a second heat treatment to dry the applied layer, thereby forming a thermoplastic resin layer.
Public/Granted literature
- US20130032277A1 MANUFACTURING METHOD FOR TRANSPARENT SUBSTRATE Public/Granted day:2013-02-07
Information query
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