Disclosed herein is a lamination apparatus including: a mechanism configured to transport a belt-like flexible substrate including a transfer layer and a supporting layer layered on each other; a mechanism configured to transport a sheet-like rigid substrate; a mechanism configured to coat adhesive to the transfer layer while transporting the belt-like flexible substrate; a mechanism configured to cut the transfer layer having the adhesive coated thereon into a sheet while transporting the belt-like flexible substrate; and a mechanism configured to laminate the transfer layer cut out into the sheet to the rigid substrate through the adhesive while transporting the belt-like flexible substrate and the sheet-like rigid substrate.