Invention Grant
- Patent Title: Tape adhering device and tape adhering method
- Patent Title (中): 胶带粘贴装置和胶带粘贴方法
-
Application No.: US13995257Application Date: 2011-11-29
-
Publication No.: US09254635B2Publication Date: 2016-02-09
- Inventor: Shingo Yamada , Kozo Odawara
- Applicant: Shingo Yamada , Kozo Odawara
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2010-287295 20101224
- International Application: PCT/JP2011/006649 WO 20111129
- International Announcement: WO2012/086132 WO 20120628
- Main IPC: B32B38/00
- IPC: B32B38/00 ; B65H35/00 ; B65H37/00 ; H01L21/67 ; H01L23/00 ; G02F1/13

Abstract:
The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated.
Public/Granted literature
- US20130269870A1 TAPE ADHERING DEVICE AND TAPE ADHERING METHOD Public/Granted day:2013-10-17
Information query