Invention Grant
- Patent Title: Thermal printhead and method of manufacturing the same
- Patent Title (中): 热敏打印头及其制造方法
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Application No.: US13870540Application Date: 2013-04-25
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Publication No.: US09254650B2Publication Date: 2016-02-09
- Inventor: Tomohiko Horikawa , Hideaki Hoki
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2012-102925 20120427
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16 ; B41J2/335 ; B41J2/345

Abstract:
A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer.
Public/Granted literature
- US20130307907A1 THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-11-21
Information query
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