Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head
- Patent Title (中): 液体喷射头,液体喷射装置和液体喷射头的制造方法
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Application No.: US14794397Application Date: 2015-07-08
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Publication No.: US09254656B2Publication Date: 2016-02-09
- Inventor: Hiroaki Okui , Isamu Togashi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-143538 20140711
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; H01R12/70 ; B41J2/175

Abstract:
A liquid ejecting head includes a basic wiring board which includes a first connection region and a second connection region, a plurality of head units, and a plurality of individual wiring boards each of which includes a first connection portion, a relay portion, and a second connection portion, and electrically connects the basic wiring board and each head unit, in which the second connection portion of an individual wiring board is fixed to the first connection region by being bent to the second connection region side, the second connection portion of an individual wiring board is fixed to the second connection region by being bent to the first connection region side, and an interval between the relay portions of the two individual wiring boards is large on the basic wiring board side compared to the head unit side.
Public/Granted literature
- US20160009087A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD Public/Granted day:2016-01-14
Information query
IPC分类: