Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US14551987Application Date: 2014-11-24
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Publication No.: US09254665B2Publication Date: 2016-02-09
- Inventor: Akira Shinoto , Keiichiro Yoshino , Masaki Uchiyama
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-253927 20131209
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejecting apparatus includes a liquid ejecting portion provided with a nozzle opening area in which a plurality of nozzles ejecting liquid onto a medium are open; and a wiping portion that wipes the nozzle opening area in a first direction and a second direction opposite to the first direction, in which the nozzle opening area includes a first wiping target area and a second wiping target area which are at different positions in a direction intersecting with the first direction, and the wiping portion wipes the first wiping target area in the first direction, and wipes the second wiping target area in the second direction.
Public/Granted literature
- US20150158302A1 LIQUID EJECTING APPARATUS Public/Granted day:2015-06-11
Information query
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