Invention Grant
- Patent Title: Package with enlarged base
- Patent Title (中): 包装扩大基数
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Application No.: US13644649Application Date: 2012-10-04
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Publication No.: US09254952B2Publication Date: 2016-02-09
- Inventor: Kelly R. Fitzwater
- Applicant: Graphic Packaging International, Inc.
- Applicant Address: US GA Atlanta
- Assignee: Graphic Packaging International, Inc.
- Current Assignee: Graphic Packaging International, Inc.
- Current Assignee Address: US GA Atlanta
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H05B6/80
- IPC: H05B6/80 ; H05B6/64 ; B65D43/00 ; B65D81/34 ; B65D5/02 ; B65D5/54

Abstract:
A microwave heating construct may include a widened base. The construct may be erected by folding end panels of the construct towards one another and optionally securing the panels in the folded position. The construct may be formed from a blank. The construct and/or blank may include a removable portion at least partially defined by a line of disruption.
Public/Granted literature
- US20130026158A1 Package with Enlarged Base Public/Granted day:2013-01-31
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