Invention Grant
- Patent Title: Mechanisms for forming micro-electro mechanical device
- Patent Title (中): 微电机械装置的形成机理
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Application No.: US14086640Application Date: 2013-11-21
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Publication No.: US09254999B2Publication Date: 2016-02-09
- Inventor: Bruce C. S. Chou , Yang-Che Chen , Chen-Chih Fan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81C1/00
Abstract:
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS sensor over the substrate. The MEMS sensor includes a floating heater disposed over the substrate. The MEMS sensor further includes a heat sink disposed over the substrate and at a side of the floating heater, and the heat sink has an air gap with the floating heater. The MEMS sensor further includes a first plurality of vias formed through the heat sink and thermally connected to the first substrate.
Public/Granted literature
- US20150137303A1 MECHANISMS FOR FORMING MICRO-ELECTRO MECHANICAL DEVICE Public/Granted day:2015-05-21
Information query
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