Invention Grant
- Patent Title: Micro device transfer head array with metal electrodes
- Patent Title (中): 具有金属电极的微器件转印头阵列
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Application No.: US13710438Application Date: 2012-12-10
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Publication No.: US09255001B2Publication Date: 2016-02-09
- Inventor: Dariusz Golda , Andreas Bibl
- Applicant: LuxVue Technology Corporation
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B81C99/00

Abstract:
A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer.
Public/Granted literature
- US20140158415A1 MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES Public/Granted day:2014-06-12
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