Invention Grant
- Patent Title: Apparatus and method for forming self-assembly arrays
- Patent Title (中): 用于形成自组装阵列的装置和方法
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Application No.: US12888146Application Date: 2010-09-22
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Publication No.: US09255002B2Publication Date: 2016-02-09
- Inventor: Dan Luo , Wenlong Cheng
- Applicant: Dan Luo , Wenlong Cheng
- Applicant Address: US NY Ithaca
- Assignee: Cornell University
- Current Assignee: Cornell University
- Current Assignee Address: US NY Ithaca
- Agency: Miller, Matthias & Hull LLP
- Main IPC: B82Y40/00
- IPC: B82Y40/00 ; B82Y30/00 ; B81C99/00 ; G03F7/004

Abstract:
Apparatus and methods for forming self-assembly arrays of substances, such as nanoparticles, on a substrate are disclosed. The apparatus may include a substrate supporting a liquid composition including the substance and a solvent, and a removable micro-mold placed over the substrate and the liquid composition. To form the self assembly arrays of the substance, the solvent may be evaporated through at least one evaporation channel formed between the micro-mold and the substrate. The evaporation channel may be adjustable by subjecting the micro-mold to a positive pressure.
Public/Granted literature
- US20110177978A1 Apparatus and Method for Forming Self-Assembly Arrays Public/Granted day:2011-07-21
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