Invention Grant
- Patent Title: Flame retardant fillers prepared from bridged polysilsesquioxanes
- Patent Title (中): 由桥连聚倍半硅氧烷制备的阻燃填料
-
Application No.: US13584017Application Date: 2012-08-13
-
Publication No.: US09255185B2Publication Date: 2016-02-09
- Inventor: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
- Applicant: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew J. Bussan
- Main IPC: C08G77/60
- IPC: C08G77/60 ; C08G77/30 ; C08G77/48 ; C08G77/52 ; C08G77/24 ; H05K1/03 ; H05K3/46

Abstract:
A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler.
Public/Granted literature
- US20140041908A1 FLAME RETARDANT FILLERS PREPARED FROM BRIDGED POLYSILSESQUIOXANES Public/Granted day:2014-02-13
Information query