Invention Grant
- Patent Title: Metamaterial and method for forming a metamaterial using atomic layer deposition
- Patent Title (中): 使用原子层沉积形成超材料的超材料和方法
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Application No.: US14200198Application Date: 2014-03-07
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Publication No.: US09255328B2Publication Date: 2016-02-09
- Inventor: Fabian Purkl , John Provine , Gary Yama , Ando Feyh , Gary O'Brien
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot Moore & Beck LLP
- Main IPC: B32B3/02
- IPC: B32B3/02 ; C23C16/455
Abstract:
A metamaterial includes a first continuous layer formed with a first material by atomic layer deposition (ALD), a first non-continuous layer formed with a second material by ALD on first upper surface portions of a first upper surface of the first continuous layer, and a second continuous layer formed with the first material by ALD on second upper surface portions of the first upper surface of the first continuous layer and on a second upper surface of the first non-continuous layer.
Public/Granted literature
- US20140272333A1 Metamaterial and Method for Forming a Metamaterial Using Atomic Layer Deposition Public/Granted day:2014-09-18
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