Invention Grant
- Patent Title: Silicon carbide substrate and method of manufacturing the same
- Patent Title (中): 碳化硅基板及其制造方法
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Application No.: US13605265Application Date: 2012-09-06
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Publication No.: US09255344B2Publication Date: 2016-02-09
- Inventor: Shin Harada , Shinsuke Fujiwara , Taro Nishiguchi
- Applicant: Shin Harada , Shinsuke Fujiwara , Taro Nishiguchi
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2011-205513 20110921
- Main IPC: C30B23/00
- IPC: C30B23/00 ; C30B29/36 ; C30B35/00 ; H01L21/02

Abstract:
A silicon carbide substrate capable of stably forming a device of excellent performance, and a method of manufacturing the same are provided. A silicon carbide substrate is made of a single crystal of silicon carbide, and has a width of not less than 100 mm, a micropipe density of not more than 7 cm−2, a threading screw dislocation density of not more than 1×104 cm−2, a threading edge dislocation density of not more than 1×104 cm−2, a basal plane dislocation density of not more than 1×104 cm−2, a stacking fault density of not more than 0.1 cm−1, a conductive impurity concentration of not less than 1×1018 cm−3, a residual impurity concentration of not more than 1×1016 cm−3, and a secondary phase inclusion density of not more than 1 cm−3.
Public/Granted literature
- US20130071643A1 SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-03-21
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