A honeycomb structure includes a tubular bonded honeycomb segment assembly having a plurality of honeycomb segments and a bonding layer which bonds side surfaces of the plurality of honeycomb segments to each other; and a pair of electrode members disposed on a side surface of the bonded honeycomb segment assembly, a volume resistivity of each of the honeycomb segments is from 1 to 200 Ωcm, at least a part of the bonding layer is made of a bonding material having a conductivity, a volume resistivity of the bonding layer is from 2 to 2000 Ωcm, and each of the pair of electrode members is formed into a band-like shape extending in an extending direction of the cells of the bonded honeycomb segment assembly, and one electrode member is disposed on a side opposite to the other electrode member via a center of the bonded honeycomb segment assembly.