An instrumentation component includes an instrumentation portion, a casing at least partially surrounding the instrumentation portion, a lead protruding from the instrumentation portion through a lead egress hole in the casing, a lead egress adapter, and a lead egress cap. The lead egress adapter is situated in the lead egress hole. The lead egress adapter includes a cup portion and a lip portion at least partially circumscribing the cup portion. The lead egress adapter includes a hole in the cup portion. The lead protrudes through the cup hole and the cup hole is tight fit to the lead. A potting material fills a remainder of the cup portion. The lip portion of the lead egress adapter contacts the casing. A lead egress cap seals the lead egress adapter to the casing. The lead egress cap further includes a cap hole through which the lead protrudes, and the cap hole is tight fit to the lead egress.