Invention Grant
- Patent Title: Method for measuring thickness of object
- Patent Title (中): 测量物体厚度的方法
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Application No.: US14286213Application Date: 2014-05-23
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Publication No.: US09255789B2Publication Date: 2016-02-09
- Inventor: Jang-Ik Park , Il-Hwan Nam , Kwan-Woo Ryu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0088094 20130725
- Main IPC: G01B11/28
- IPC: G01B11/28 ; G01B11/06

Abstract:
Methods for measuring a thickness of an object including acquiring at least one of a wavelength domain spectrum for an amplitude ratio (Ψ) and a phase difference (Δ) of reflected light from a film material, converting the wavelength domain spectrum into a 1/wavelength domain spectrum, acquiring a resulting spectrum by performing fast fourier transform (FFT) on the 1/wavelength domain spectrum, and measuring a thickness of the film material from the resulting spectrum may be provided.
Public/Granted literature
- US20150029517A1 METHOD FOR MEASURING THICKNESS OF OBJECT Public/Granted day:2015-01-29
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