A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump.