Invention Grant
- Patent Title: Induction heating fusing device and image forming apparatus
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Application No.: US14676249Application Date: 2015-04-01
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Publication No.: US09256175B2Publication Date: 2016-02-09
- Inventor: Takashi Kondo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: JP2011-272302 20111213; KR10-2012-0141201 20121206
- Main IPC: G03G15/00
- IPC: G03G15/00 ; G03G15/20 ; H05B6/06 ; H05B6/14

Abstract:
An induction heating fusing device and an image forming apparatuses that may control even a very small current region by tracking a resonance frequency to perform PWM control and phase control without considering a deviation of a part constant or a temperature change are provided. The induction heating fusing device includes: a serial resonance circuit having an induction coil and a condenser; a phase comparator, a phase controller, a resonance frequency tracking oscillator, and a PWM (pulse width modulation) signal generator. The phase comparator compares a phase of a pulse outputted by the PWM signal generator with a phase of current flowing through the induction coil, outputs a comparison result obtained by the comparing to the phase controller when controlling the phase, and outputs the comparison result to the resonance frequency tracking oscillator when performing PWM control.
Public/Granted literature
- US20150205239A1 INDUCTION HEATING FUSING DEVICE AND IMAGE FORMING APPARATUS Public/Granted day:2015-07-23
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