A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.