Invention Grant
US09257142B2 Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered product
有权
热反应型抗蚀剂材料，使用该材料的热平版印刷用层压体，以及使用该材料和层叠体制造模具的方法
- Patent Title: Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered product
- Patent Title (中): 热反应型抗蚀剂材料，使用该材料的热平版印刷用层压体，以及使用该材料和层叠体制造模具的方法
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Application No.: US13123854Application Date: 2009-10-13
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Publication No.: US09257142B2Publication Date: 2016-02-09
- Inventor: Yoshimichi Mitamura , Kazuyuki Furuya , Norikiyo Nakagawa , Masatoshi Maeda
- Applicant: Yoshimichi Mitamura , Kazuyuki Furuya , Norikiyo Nakagawa , Masatoshi Maeda
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-265640 20081014; JP2009-008910 20090119; JP2009-098065 20090414; JP2009-188004 20090814
- International Application: PCT/JP2009/067737 WO 20091013
- International Announcement: WO2010/044400 WO 20100422
- Main IPC: G11B7/243
- IPC: G11B7/243 ; G11B7/26 ; B82Y10/00 ; B82Y40/00 ; G03F7/00
Abstract:
A heat-reactive resist material of the invention is characterized in that the boiling point of the fluoride of the element is 200° C. or more. By this means, it is possible to achieve the heat-reactive resist material having high resistance to dry etching using fluorocarbons to form a pattern with the deep groove depth.
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