Invention Grant
- Patent Title: Metal powder and electronic component
- Patent Title (中): 金属粉末和电子元件
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Application No.: US14084387Application Date: 2013-11-19
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Publication No.: US09257216B2Publication Date: 2016-02-09
- Inventor: Mitsuru Odahara
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2011-226471 20111014
- Main IPC: H01F1/33
- IPC: H01F1/33 ; H01F1/01 ; H01F1/09 ; B22F1/02 ; H01F1/26 ; H01F17/00
Abstract:
Metal powder has composite particles each coated with a Zn-based ferrite film not containing Ni.
Public/Granted literature
- US20140070916A1 METAL POWDER AND ELECTRONIC COMPONENT Public/Granted day:2014-03-13
Information query
