Invention Grant
- Patent Title: Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
- Patent Title (中): 使用该方法制造电路板和芯片封装和电路板的方法
-
Application No.: US13924705Application Date: 2013-06-24
-
Publication No.: US09257310B2Publication Date: 2016-02-09
- Inventor: Sang-Min Lee
- Applicant: HAESUNG DS CO., LTD.
- Applicant Address: KR Changwon-si
- Assignee: HAESUNG DS CO., LTD.
- Current Assignee: HAESUNG DS CO., LTD.
- Current Assignee Address: KR Changwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0116744 20121019; KR10-2013-0020670 20130226
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H05K3/46 ; H01L23/14 ; H01L23/498 ; H01L25/065 ; H05K3/00 ; H01L23/053 ; H01L23/00 ; H01L23/538 ; H05K1/03 ; H05K3/42
Abstract:
Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body.
Public/Granted literature
Information query
IPC分类:
